导电相含量对高银导电银浆微观形貌和性能的影响

Effect of conductive phase content on microstructure and properties of high Ag conductive silver paste

为制备PET薄膜所需要的导电银浆,以不同含量的导电相银粉制备高比例银含量导电银浆,并用丝网印刷将银浆印刷至PET薄膜上。采用金相显微镜、扫描电子显微镜、直流低电阻测试仪、高级旋转流变仪、ACE-QFH型百格刀对导电银浆进行黏度、导电性能、弯折能力、金相分析及附着力测试。结果表明:不同导电相银粉含量对导电银浆有较大的影响,在银粉A与银粉B比例为5∶1,导电相含量为65%,银浆黏度达到最小值为41.2 Pa·s,体积电阻率达到最小值为5.56×10^(-5)Ω·cm,且点和面的接触也比较致密,印制银线边缘光滑无毛刺,表面粗糙度低,附着力最好。

In order to prepare the conductive silver paste required for PET film,a high proportion of conductive silver paste with different contents of conductive phase silver powder was prepared,and the silver paste was printed onto PET film by screen printing.Metallographic microscope,scanning electron microscope,DC low resistance tester,advanced rotational rheometer and ACE-QFH type 100-grid knife were used to test the viscosity,conductivity,bending ability,metallographic analysis and adhesion test of conductive silver paste.In the case of a ratio of silver powder A to B being 5∶1,when the conductive phase content is 65%,the viscosity of silver paste reaches a minimum value of 41.2 Pa·s,the minimum value of the volume resistivity reaches 5.56×10^(-5)Ω·cm,the contact between the point and the surface is also relatively dense,the edge of the printed silver wire is smooth and burr-free,the surface roughness is low,and the adhesion is the best.