航空电子产品导热垫使用问题与对策探讨

Discussion on the Problems and Countermeasures of Using Thermal Conductive Pads in Avionics Products

介绍了航空电子产品散热的重要性和导热垫的特点,剖析了导热垫在航空电子产品装配应用过程中存在的导热垫硬度和尺寸公差较大、印制板变形、结构设计不合理、整机装配精度较差等问题及产生原因,并提出降低初始装配应力、强化可装配性设计、控制公差等解决措施,为后续导热垫的设计选型及装配提供参考。

The importance of heat dissipation in avionics products and the characteristics of thermal pads are introduced.The problems that the thermal pad hardness and dimensional to tolerances,printed board deformation and unreasonable structural design that exist when thermal pads are used in the assembly process of avionics products,as well as poor assembly accuracy of the whole machine and other problems and their causes,are analyzed.Then solutions are proposed such as reducing initial assembly stress,strengthening assembly design,and controlling tolerances in order to provide reference for subsequent design selection and assembly of thermal pads.