一种基于背对背贴装的QSFP-DD连接器过孔设计方法分析

Design of Via for QSFP-DD Connector Based on Bellyto-belly Surface Mounting

阐述使用Cadence 3D电磁场仿真工具Clarity,对QSFP-DD连接器和PCB焊盘引脚及其两端的过孔模型进行电磁仿真分析,可以实现一种在极低的PCB设计制作成本下基于背对背贴装QSFP-DD的扇出过孔方法。分析和仿真结果显示,该方法在可以不使用高成本PCB技术的基础上实现其功能。

This paper describes modeling of belly-to-belly QSFP-DDconnector with padsand two kinds of via near the ends of padon PCB by Cadence Advanced 3D Electromagnetic simulation tool-Clarity.The simulation results showed thatthe method along with the proposed fan-out pattern can achieve 56Gbps speed goal without high-cost PCB technology.