附载体极薄铜箔的剥离机制

Stripping Mechanism of Ultra-thin Copper Foil with Carrier

目的研究一种极薄铜箔制备过程中所需要的新型剥离层结构,以此来实现极薄铜箔的顺利剥离。方法利用两步电沉积法制备了可剥离的极薄铜箔,利用EBSD分析了“载体铜箔-剥离层-极薄铜箔”结构的附载体铜箔截面晶粒分布规律,利用聚焦离子束技术(FIB)制备了TEM样品,通过HRTEM对“载体铜箔-剥离层-极薄铜箔”结构中剥离层/极薄铜箔、剥离层/载体铜箔的界面微观结构进行了研究。结果与单一Ni剥离层相比,通过两步电沉积法制备的复合剥离层(Ni,Cr-O)具有更好的可剥离性,复合剥离层由有序Ni层和无序Cr-O层组成。复合剥离层中的Ni层与载体铜箔相结合,界面完全共格,形成较强的界面结合;复合剥离层中的无序Cr-O层与极薄铜箔相结合,Cr-O层与极薄铜箔界面原子紊乱,形成较弱的界面结合。对制备的极薄铜箔剥离强度进行测试可知,极薄铜箔与载体铜箔能够剥离,极薄铜箔与剥离层之间的剥离强度约为0.01N/mm。结论利用载体铜箔-剥离层、极薄铜箔-剥离层结合界面的差异化实现了界面结合的差异化,复合剥离层内有序和无序的结构分布调控了载体铜箔与剥离层、极薄铜箔与剥离层之间的界面结合,使剥离层与极薄铜箔之间的结合弱于剥离层与载体铜箔之间的结合,有助于极薄铜箔与剥离层分离,同时剥离层与载体铜箔之间不会分离,进而获得可洁净剥离的极薄铜箔。

The work aims to develop a new stripping layer structure required in the preparation of ultra-thin copper foil to realize the smooth stripping of ultra-thin copper foil.The strippable ultra-thin copper foil was prepared by two-step electrode-position method.The grain distribution of the copper foil with carrier in the structure of"carrier foil-stripping layer-ultra-thin coil foil"was analyzed by EBSD,and TEM samples were prepared by focusing ion beam technique(FIB).The microstructure of the interface between stripping layer/ultra-thin copper foil and stripping layer/carrier copper foil in the structure of"carrier foil-stripping layer-ultra-thin coil foil"was studied by HRTEM.The composite stripping layer(Ni,Cr-O)prepared by two-step electrodeposition had better stripping property than the single Ni stripping layer.The composite stripping layer consisted of or-dered Ni layer and disordered Cr-O layer.The Ni layer in the composite stripping layer was combined with the carrier copper foil,and the interface was completely coherent,forming a strong interface metallurgical bonding.The disordered Cr-O layer in the composite stripping layer was combined with the ultra-thin copper foil,and the interfacial atoms of Cr-O layer and ultra-thin copper foil were disordered,forming a weak interface bonding.The stripping strength of the ultra-thin copper foil prepared was tested.The stripping strength between the ultra-thin copper foil and the carrier copper foil could not be separated,and the strip-ping strength between the ultra-thin copper foil and the stripping layer was 0.01 N/mm.The difference of interface bonding was realized by the difference of carrier foil-stripping layer and ultra-thin copper foil-stripping layer bonding interface.The ordered and disordered structure distribution in the composite stripping layer regulates the interface bonding between carrier copper foil and stripping layer,and between ultra-thin copper foil and stripping layer,so that the bonding between stripping layer and ul-tra-thin copper foil is less than that between stripping layer and carrier copper foil.It is helpful to separate the ultra-thin copper foil from the stripping layer,and the stripping layer and the carrier copper foil will not be separated at the same time,thus the ul-tra-thin copper foil that can be cleanly stripped is obtained.