摘要
对C19210(Cu-0.1Fe-0.03P)合金经不同温度退火后的显微组织进行观察,并对其抗拉强度、显微硬度、导电率等进行测试。结果表明,在200~500℃退火时,轧制态C19210合金依次发生的是回复和再结晶。当退火温度升高时,C19210合金的抗拉强度呈下降趋势,但在加工硬化减弱、弥散强化加强及晶粒尺寸演变的共同作用下,450℃时抗拉强度轻微上升至416 MPa。C19210合金的延伸率和电导率随退火温度的升高呈上升趋势,显微硬度呈下降趋势,但由于第二相析出,400℃退火时硬度提升至128HV,随后迅速下降。
In this paper,the microstructure of C19210(Cu-0.1Fe-0.03P)alloy annealed at different temperatures is observed,and its tensile strength,microhardness and electrical conductivity are measured.The result show that the recovery and recrystallization of rolled C19210 alloy occur in sequence at 200~500℃.The tensile strength of C19210 alloy decreases when the annealing temperature increases,but the tensile strength increases slightly to 416MPa at 450℃under the combined effects of work hardening weakening,dispersion strengthening and grain size evolution.The elongation and conductivity of C19210 alloy increase with the increase of annealing temperature,and the microhardness decreases.However,due to the second phase precipitation,the hardness increases to 128HV at 400℃and then decreases rapidly.
作者
王梦娜
方冬松
Wang Mengna;Fang Dongsong(Chinalco Luoyang Copper Processing Company,LuoYang 471059,China)
出处
《有色金属加工》
CAS
2024年第4期30-33,50,共5页
Nonferrous Metals Processing
