新赛道 新商机 新希望——变化中的网版与新赛道网版(十一)

Changing Screen Printing Plate and Screens on the New Track(Part 11)

现代的电子元器件组装技术,随着电子元器件的小型化、微型化,以及器件间距、开孔尺寸越来越小,模版厚度越来越薄。为了增加焊锡膏释放率,一般采用电铸钢版或加纳米涂层的激光钢版,同时还要选择印刷精度较高、全自动化智能化的锡膏印刷机(网版印刷机)。

Modern electronic component assembly technology,with the miniaturization and miniaturization of electronic components,as well as the device spacing,opening size is getting smaller and smaller,and the stencil thickness is getting thinner and thinner.In order to increase the solder paste release rate,electrocast steel plates or laser steel plates with nano-coating are generally used,and at the same time,a fully automated and intelligent solder paste press(screen printing machine)with high printing accuracy is also selected.