CNTs/Cu层状复合材料的制备及其组织和性能研究

Research on Preparation of CNTs/Cu Layered Composite and Its Microstructure and Properties

采用扩散结合法将分散后的碳纳米管附着在铜箔表面,经裁剪、堆叠和预压后使用真空热压烧结炉进行烧结,制备出具有优良导电性的CNTs/Cu层状复合材料。使用SEM、EDS和XRD等对样品的微观形貌和成分进行表征,使用显微硬度计和导电率检测仪等对样品性能进行测试。结果表明:在热压烧结过程中,一定量铜扩散到CNTs层中,有效改善了碳纳米管层和铜层的结合能力。相比于纯铜,CNTs/Cu层状复合材料在硬度提高45%的同时,在平行于碳纳米管层方向导电率达到91%IACS,而垂直于碳纳米管层方向也仍具有80.6%IACS的导电率。

The dispersed carbon nanotubes were attached to the surface of copper foil by diffusion bonding method.After cutting,stacking and pre-pressing,CNTs/Cu layered composite with excellent conductivity were prepared by sintering in vacuum hot pressing sintering furnace.The microscopic characterization of CNTs/Cu layered composite was carried out by SEM,EDS and XRD.Sample performance was tested using a microhardness meter and a conductivity detector,etc.The results show that during hot pressing sintering,a certain amount of copper diffuses into CNTs layer,which effectively improves the bonding ability between CNTs layer and copper layer.Compared with pure copper,CNTs/Cu layered composite not only improve the hardness by 45%,but also achieve 91%IACS in the direction parallel to the carbon nanotube layer and 80.6%IACS in the direction perpendicular to the carbon nanotube layer.