基于场路联合仿真的1785~2190 MHz集总参数隔离器设计

Design of 1785 to 2190 MHz lumped parameter isolator based on field-circuit combined simulation

提出了一种工作带宽1785~2190 MHz的集总参数隔离器设计。隔离器设计使用了高效率的场路联合仿真方法,采用四层电路板交叠的交互电路排布方案。与常规的集总参数隔离器比较,提出的宽带集总参数隔离器频段覆盖三个频段,并且工作带宽内性能指标与窄带器件接近。实测结果显示在1785~2190 MHz工作带宽内,输入输出回波损耗、隔离度均大于15 dB,插入损耗小于2.5 dB,尺寸为7×7 mm。

In this paper,a 1785 to 2190 MHz lumped parameter isolator is proposed.High efficiency field and circuit co-simulation was adopts and interactive circuit arrangement scheme of four-layer circuit board was applied.Compared with the conventional isolator,the proposed one covers three frequency bands and its performance is closed to the narrowband isolators.The measured result shows that input-output return loss and isolation are greater than 15 dB within the working bandwidth of 1785-2190 MHz,the insertion loss is less than 2.5 dB,and the size is 7×7 mm.