不溶性阳极脉冲电镀铜添加剂的研究

Study on additives for insoluble anode pulse copper plating

通过研究电镀添加剂在不溶性阳极脉冲电镀中的使用,发现光亮剂在脉冲电镀中的消耗量是在直流电镀中的3~6倍,这一消耗量过大的问题拉高了脉冲电镀成本。并且,由于光亮剂消耗量太大,如补充不及时会造成镀件表面无光泽,带来镀件品质的不稳定性。进一步研究发现,具有整平剂基团和光亮剂基团的添加剂结构可以减少消耗量,添加剂SCCBL可以辅助光亮作用,能有效降低光亮剂的损耗。

Through research on the use of electroplating additives in insoluble anode pulse plating,it is found that the consumption of brightener in pulse plating is 3-6 times that in direct current plating.This excessive consumption raises the cost of pulse plating,and due to the excessive consumption of brightener,if the brightener is not supplemented in time,it can cause the surface of the plated part to become dull,resulting in instability in the quality of the plated part.Further research finds that the additive structure with a leveler group and a brightener group can reduce the consumption.The additive SCCBL can assist in brightening and effectively reduce the loss of brightener.