基于GRA微细铣削单晶硅工艺参数优化及试验研究

Study on Process Parameter Optimization and Test of Monocrystalline Silicon Based on GRA Microfine Milling

为满足实际应用中对单晶硅微槽底部的表面粗糙度、上口尺寸精度以及材料去除率的需求,选择微细铣削的加工方法,并利用灰色关联度分析法对以上3种评价指标进行参数优化。通过设计正交试验获得评价指标的预测值,并分析了各个指标与工艺参数之间的关系;运用灰色关联法计算试验序列中各评价指标的灰色关联系数,并对各个试验序列的灰色关联度进行了排序,从而得到了最佳的工艺参数组合,并通过多次试验来验证其可行性,加工出了表面粗糙度为71.2 nm的微槽,提高其加工质量与加工精度。

In order to meet the requirements of surface roughness,upper port size precision and material removal rate of the bottom of monocrystalline silicon microgroove in practical application,the processing method of microfine milling was selected,and the above three evaluation indexes were optimized by grey correlation analysis.By designing the orthogonal test,the predicted values of the evaluation indexa were obtained,and the relationship between each index and the process parameters was analyzed.Then the grey correlation method was used to calculate the grey correlation coefficient of each evaluation index of the test sequence,and the grey correlation degree of each test sequence was ranked,so as to obtain the best combination of process parameters,and many experiments were carried out to verify its feasibility.The micro-groove with surface roughness of 71.2 nm is machined,and the machining quality and precision of micro-grooves are improved.