摘要
采用金属Al箔作为连接材料,探究空气气氛下连接温度对Si C陶瓷连接接头结构和性能的影响。结果表明,1000℃连接时金属Al的过量流失会导致Si C接头连接层孔洞缺陷的产生;保持热处理工艺不变,将连接温度降低至900℃,不仅可避免连接层气孔缺陷的产生,而且可有效促进中间层Al单质向Al_(2)O_(3)的完全转化,相比于1000℃连接的Si C接头,其室温剪切强度从(22.0±5.4)MPa提高到(117.0±18.7) MPa。
The effect of the joining temperature on the microstructure and properties of the SiC joint joined by using Al foil as an interlayer under air atmosphere was investigated.The results show that the loss of metal Al at the high temperature of 1000℃can cause the formation of pores in the interlayer of the SiC joint.Under the same heating treatment process,reducing the joining temperature to 900℃can not only avoid the generation of pores defects in the connection layer,but also can effectively promote the complete conversion of the middle layer Al to Al_(2)O_(3).Compared with the SiC joint joined at 1000℃,the room temperature shear strength of the SiC joint joined at 900℃is improved from(22.0±5.4)MPa to(117.0±18.7)MPa.
作者
吴利翔
薛佳祥
翟剑晗
刘洋
马海滨
任啟森
廖业宏
郭伟明
林华泰
WU Lixiang;XUE Jiaxiang;ZHAI Jianhan;LIU Yang;MA Haibin;REN Qisen;LIAO Yehong;GUO Weiming;LIN Huatay(Nuclear Fuel and Materials Department,China Nuclear Power Technology Research Institute,Shenzhen 518026,China;School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou 510006,China)
出处
《热加工工艺》
北大核心
2024年第13期46-49,共4页
Hot Working Technology
基金
广东省自然科学基金面上项目(2022A1515010735)
中国博士后科学基金面上基金项目(2021M703024)。
关键词
碳化硅
钎焊
连接温度
显微结构
剪切强度
silicon carbide
brazing
joining temperature
microstructure
shear strength
