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微尺度下基于对流混合的充填不平衡影响因素数值模拟分析

Numerical simulation analysis of factors affecting filling unbalance based on convective mixing at microscale
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摘要 针对流道中采用对流混合的充填不平衡新的调控方法,通过数值模拟研究了微尺度聚合物熔体流动因素对流道熔体温度分布调控特性的影响。以“H”型流道作为研究对象,在流道中布局了对流混合装置。采用单因素的实验方法研究熔体温度、对流换热系数、流道系统对熔体充填不平衡的影响。数值模拟结果表明:绝热边界条件时,升高熔体温度伴随着熔体自身黏度的下降,对称点之间的温差减小,改善了充填不平衡,对流换热边界时,升高熔体温度加大了熔体通过壁面散失的热量,对称点之间的温差加大,充填不平衡越明显;对流换热系数越小,熔体与壁面之间的导热效率越低,熔体平均温度较高,增加了对称点之间的温差,加剧了充填不平衡;随着流道系统的减小,微尺度效应减弱,可以降低对称点间的温差,充填不平衡的现象得到了较好的改善。其中对流换热系数对充填不平衡的影响最大,其次是流道系统,最后是熔体温度。 Aiming at the new control method of filling unbalance in the flow channel by using convection mixing,the influence of micro-scale polymer melt flow factors on the control characteristics of melt temperature distribution in the flow channel was studied by numerical simulation.Taking the"H"flow channel as the research object,the convection mixing device was arranged in the flow channel.The effects of melt temperature,convective heat transfer coefficient and flow channel size on melt filling unbalance were studied by single factor experiment.The numerical simulation results show that,the increase in melt temperature is accompanied by the decrease of melt self-viscosity under adiabatic boundary conditions.The temperature difference between symmetric points decreases,which improves the filling imbalance.Under the convective heat transfer boundary,the increase of melt temperature increases the heat loss of melt through the wall,and the increase of temperature difference between symmetric points leads to the more obvious filling imbalance.The lower the convective heat transfer coefficient,the lower the thermal conductivity efficiency between melt and wall,and the higher the average melt temperature,which increases the temperature difference between symmetric points and intensifies the filling imbalance.With the decrease in the size of the flow path,the micro-scale effect is weakened,the temperature difference between symmetric points can be reduced,and the phenomenon of filling imbalance is better improved.The convective heat transfer coefficient has the greatest influence on the filling unbalance,followed by the flow channel size,and finally the melt temperature.
作者 刘洋 徐斌 王邱宇 杜洋 LIU Yang;XU Bin;WANG Qiuyu;DU Yang(School of Manufacturing Science and Engineering,Southwest University of Science and Technology,Mianyang 621010,Sichuan,China)
出处 《材料工程》 EI CAS CSCD 北大核心 2024年第8期212-218,共7页 Journal of Materials Engineering
基金 国家自然科学基金项目(51475395)。
关键词 对流混合 熔体温度 对流换热系数 流道系统 充填不平衡 convective mixing melt temperature convective heat transfer coefficient runner system unbalance of packing
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  • 1杨卫民,谢鹏程,杨高品.注射成型多模腔充填不平衡现象的产生机理(Ⅰ)——模具流道系统中熔体流动行为的研究[J].中国塑料,2004,18(11):93-99. 被引量:24
  • 2阎守胜.介观物理[J].科技导报,1994,12(7):24-25. 被引量:7
  • 3Yang Weimin,Hidetoshi Yokoi.A Study on Filling Balance in Multi—cavity Molds[C].JSPP.JSPP’02 Tech.Papers,东京:成形加工学会,2002.259-262.
  • 4Yang Weimin, Hidetoshi Yokoi. Improving the Plastics Filling Balance in Multi-cavity Molds by 2-rate Injection[C]. PPS 2002 Papers, Taipei : Polymer Processing Society. 2002.
  • 5Yang Weimin, Hidetoshi Yokoi. Visual Analysis of the FlowBehavior of Core Material in a Fork Portion of Plastic Sand-wich Injection Molding [ J ]. Polymer Testing, 2003,22 ( 1 ) :37-43.
  • 6Yasuhiko MURATA,Hidetoshi YOKOI.Temperature Mea—surement Technologies for Injection Molding[C].Hidetoshi YOKOI.生产研究.东京:东京大学国际产学共同研究所,2000.17~26.
  • 7Hidetoshi YOKOI, Yasuhiko MURATA, t-rkroshi TSLINAKCF:k-II.Measurement of Melt Temperature Distribution along the Cavity Thickness Direction by Using Integrated Thermocou-ple Sensor[ C]. Hidetoshi YOKOI.生产研究,东京:东京大学国际产学共同研究所, 2000.353-360.
  • 8Yasuhiko MURATA, Hidetoshi YOKOI, Yukiharu UEDA.Measurement of Melt Temperature Profile inside the Nozzle of Injection Molding Machine by Integrated Thermocouple Sensor[C]. Hidetoshi YOKOI. 生产研究,东京:东京大学国际产学共同研究所, 1998. 165-171.
  • 9Hidetoshi Yokoi. Measurement of Melt Temperature Profilesinside a Nozzle by Using Integrated Thermocouple CeramicSensor[C]. Hidetoshi Yokoi.生产研究,东京:东京大学国际产学共同研究所,1998. 172 - 175.
  • 10周兆英,叶雄英,崔天宏,张联.微米纳米技术及微型机电系统[J].光学精密工程,1998,6(1):1-7. 被引量:28

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