摘要
高温共烧陶瓷(HTCC)双面腔体在加工时极易发生变形,严重时可导致产品无法正常加工。在HTCC制备过程中,层压工艺是影响HTCC双面腔体形变的最重要的工艺。针对HTCC双面腔体加工时发生的形变问题,设计了一种全新的层压模具,并对其销钉结构进行优化。与传统的层压模具相比,新的层压模具具有双面腔体配合带底座销钉的特点,其能够大幅提高双面腔体结构HTCC层压一致性,解决传统层压模具存在的腔体变形问题。同时,通过调节销钉底座尺寸,改善了双面腔体结构HTCC的层压压痕问题。当底座直径为9~12mm时,可有效保证双面腔体的层压效果。上述结果为后续双面腔体结构HTCC加工提供了参考。
The high temperature co-fired ceramic(HTCC)double-face cavity is prone to deformation during processing,and the product can not be processed normally in severe cases.In the preparation process of HTCC,the lamination process is the most important process that affects the deformation of HTCC double-face cavity.Aim at the deformation problem of HTCC double-face cavity during processing,a new lamination mold was designed and its pin structure was optimized.Compared with traditional lamination molds,the new lamination mold has the characteristics of a double-face cavity with a base pin,which can greatly improve the consistency of HTCC lamination in the double-face cavity structure and solve the problem of cavity deformation existing in traditional lamination molds.Meanwhile,the lamination indentation problem of the double-face cavity structure HTCC is improved by adjusting the size of the pin base.When the base diameter is 9-12 mm,it can effectively ensure the lamination effect of the double-face cavity.The above results provide the reference for the subsequent HTCC processing of double-face cavity structures.
作者
程换丽
淦作腾
马栋栋
王杰
刘曼曼
Cheng Huanli;Gan Zuoteng;Ma Dongdong;Wang Jie;Liu Manman(The 13^(th) Research Institute,CETC,Shijiazhuang 050051,China)
出处
《微纳电子技术》
CAS
2024年第8期39-44,共6页
Micronanoelectronic Technology
关键词
高温共烧陶瓷(HTCC)
层压
模具
双面腔体
销钉
变形
high temperature co-fired ceramic(HTCC)
lamination
mold
double-face cavity
pin
deformation