激光加工氧化铝生瓷微结构制备方法

Preparation Method of Microstructure on the Alumina Green Tapes by Laser Machining

Al_(2)O_(3)陶瓷具备机械强度高、耐热性好、耐腐蚀的优势。基于激光减材加工技术,介绍了Al_(2)O_(3)生瓷激光减材加工的基本原理。通过建立激光能量密度模型,计算改变激光加工参数时的激光能量密度,从而对加工深度进行预测。通过对比激光加工功率、填充间距、扫描速度和激光重复频率的实验结果,分析了不同加工参数对Al_(2)O_(3)生瓷加工深度和表面粗糙度的影响规律。实验结果表明,通过使用合适的加工参数,在Al_(2)O_(3)生瓷上可制备深度12~280μm和表面粗糙度0.5~1.0μm的腔体。单脉冲能量是影响Al_(2)O_(3)生瓷加工深度的主要因素。在激光能量密度不变的情况下,单脉冲能量(20~200μJ)越高,加工深度越深。该研究验证了激光减材加工技术在Al_(2)O_(3)生瓷腔体直接成型加工中的可行性,推动了激光加工腔体技术在陶瓷封装外壳中的应用。

Al_(2)O_(3) as a ceramic packaging material has the advantages of high mechanical strength,good heat resistance and corrosion resistance.Based on the laser substractive machining technology,the basic principle of laser substractive machining of Al_(2)O_(3) green tapes was introduced.The machining depth could be predicted through establishing a laser energy density model and calculating the laser energy density as changing the laser machining parameters.The influence laws of different machining parameters on the machining depth and surface roughness of Al_(2)O_(3) green tapes was analyzed by comparing experimental results of laser machining power,filling spacing,scan speed and laser repetition frequency.The experiment results show that cavities with depth of 12-280μm and surface roughness of 0.5-1.0μm can be prepared on the Al_(2)O_(3) green tapes by using appropriate machining parameters.The single pulse energy is the main factor affecting the machining depth of Al_(2)O_(3) green tapes.In the case of constant laser energy density,the higher the single pulse energy(20-200μJ),the deeper the machining depth.The feasibility of direct machining cavities at the Al_(2)O_(3) green tapes by laser substractive machining technology is verified,which promotes the application of laser machining cavities technology in the ceramic packaging shell.