垂直电镀挂具对TO封装陶瓷外壳表面镀镍层厚度均匀性的影响

Effect of Vertical Plating Rack on Uniformity of Nickel Coating Thickness on the Surface of TO Package Ceramic Shell

针对封装陶瓷外壳表面镀层厚度均匀性方面的重要性,利用定制的TO封装陶瓷外壳垂直电镀专用挂具,通过电沉积的方式在TO封装陶瓷外壳的表面电镀镍层。利用X射线荧光(XRF)光谱仪测量研究了TO封装陶瓷外壳相对阳极所在平面与阳极平面间的夹角(θ)对镀镍层厚度均匀性的影响。结果表明,当θ为30°时,在键合指与引线端表面电镀镍层能够实现较好的均匀性,此时的镀层厚度变异系数为24.42%,相比θ为0°和45°时,明显降低了镀镍层厚度的波动范围,有效提升了镀镍层厚度的均匀性。

In view of the importance of the coating thickness uniformity on the surface of package cramic shell,and using a customized vertical plating rack for the transistor outline(TO)package ceramic shell,the nickel layer of was electroplated on the surface of TO package ceramic shell by electrodeposition.The effect of angle(θ)between the anode plane and the TO package ceramic shell plane on the uniformity of nickel coating thickness was measured and studied by Xray fluorescence(XRF)spectrometer.The results show that when the θ is 30°,the better uniformity can be achieved by electroplating a nickel coating on the surface of the bonding finger and the lead end,and the coefficient of variation of coating thickness is 24.42%.Compared with the θ of 0°and 45°,the fluctuation range of nickel coating thickness at 30°is significantly reduced,thus the uniformity of nickel coating thickness is effectively improved.