微电子封装用Cu键合丝研究进展

Research Progress of Cu Bonding Wires for Microelectronics Packaging

引线键合仍然是微电子封装中最流行的芯片互连技术,在未来很长一段时间内都不会被其他互连方法所取代。Au键合丝由于其独特的化学稳定性、可靠的制造和操作性能,几十年来一直是主流半导体封装材料。然而,Au键合丝价格的急剧上涨促使业界寻找用于微电子封装的替代键合材料,如Cu键合丝。与Au键合丝相比,使用Cu键合丝的主要优势是更低的材料成本、更高的电导率和热导率,使更小直径的Cu键合丝能够承受与Au键合丝相同的电流而不会过热,以及更低的Cu和Al之间的反应速率,这有助于提高长期高温存储条件下的键合可靠性。文章首先简要介绍了键合丝的发展历史。其次,介绍了Cu键合丝的可制造性和可靠性。最后,提出了键合丝的发展趋势。

Wire bonding is still the most popular chip interconnection technology in microelectronic packaging and will not be replaced by other interconnection methods for a long time in the future.Au bonding wire has been a mainstream semiconductor packaging material for decades owing to its unique chemical stability,reliable manufacturing,and operational properties.However,the steep increase in the price of Au bonding wires has prompted the industry to seek alternative bonding materials for microelectronics packaging,such as Cu bonding wires.The main advantages of using Cu bonding wires over Au bonding wires are lower cost,higher electrical and thermal conductivity enabling smaller-diameter Cu bonding wires to conduct the same current as Au bonding wires without overheating,and lower reaction rates between Cu and Al,which improve the bonding reliability under long-term high-temperature storage conditions.This study briefly introduces the development history of bonding wires.Moreover,the manufacturability and reliability of Cu bonding wires are discussed.Finally,the trend of bonding wire development is presented.