固化温度对封装基板用环氧树脂绝缘增层胶膜性能的影响

Effect of curing temperature on properties of epoxy resin insulation build-up films for packaging substrates

环氧树脂绝缘增层胶膜是包括倒装芯片球栅格阵列(FCBGA)封装基板在内的多种先进封装技术的核心关键材料,其性能直接受到固化工艺的影响。为探究固化温度对环氧树脂绝缘增层胶膜性能的影响规律,对预固化温度170、180和190℃样品的固化度、表面粗糙度和剥离强度进行测试。结果表明:随着预固化温度的提高,样品固化度呈稳步上升趋势,而Desmear处理后的表面粗糙度降低。随着预固化温度的提高,ABF-T31的最小剥离强度下降,而NBF-T23则出现先上升后下降的趋势,可能是由于170℃下的固化度过低导致Desmear处理后产生缺陷而影响剥离强度。

The epoxy resin insulating build-up film is the core and key material of many advanced packaging technologies including FCBGA packaging substrate,and its performance is directly affected by the curing process.To investigate the influence of curing temperature on the properties of epoxy resin insulation build-up film,the curing degree,surface roughness and peel strength of samples pre-cured at 170,180 and 190 C were tested.The results showed that with the increase of pre-curing temperature,the curing degree of the sample showed a steady upward trend,while the surface roughness decreased after Desmear treatment.With the increase of precuring temperature,the minimum peel strength of ABF-T31 decreased,while that of NBF-T23 increased first and then decreased,which may be due to the low curing degree at 170℃,resulting in defects after Desmear treatment and affecting the peel strength.