基于邻苯二甲腈树脂的高耐热电子封装模塑料的制备

Preparation of high heat-resistance electronic packaging molding compound based on phthalonitrile resin

以4-氨基苯氧基邻苯二甲腈(APN)和多官能环氧树脂为基体树脂,2-甲基咪唑为固化促进剂,配合无机填料等助剂,制备了电子封装模塑料(AEM)。对AEM的热性能、力学性能、耐老化性能、介电性能和阻燃性能进行了测试,并与商用环氧模塑料(EMC)作了对比。AEM的成型工艺与EMC相容。与商用EMC固化物相比,固化后的AEM表现出优异的高温稳定性(T_(g)>230℃)和耐高温老化性能(200℃,500h)。此外,AEM固化物具有较低的介电常数和介电损耗,表现出良好的电绝缘性。值得注意的是,AEM固化物可以在不添加阻燃剂的情况下具有阻燃效果,且能达到UL-94V-0级别。该模塑料在功率器件封装领域具有良好的应用前景。

The electronic packaging molding compound(AEM)was prepared with 4-aminophenoxy-o-phthalonitrile(APN)and multifunctional epoxy resin as matrix resins,2-methylimidazole as curing accelerator,and inorganic fillers.The thermal properties,mechanical properties,aging resistance,dielectric properties and flame retardancy of AEM were tested and compared with those of commercial epoxy molding compound(EMC).The molding process of AEM was compatible with that of EMC.The cured AEM exhibited excellent high temperature stabilty(T_(g)>230℃)and high temperature aging resistance(200℃,500 h)compared with the cured EMC.In addition,the cured AEM had low dielectric constant and dielectric loss,exhibiting a good electrical insulation.It was important to note that the cured AEM exhibited a good flame-retardant performance without the addition of flame retardant,and could reach V-0 rating in UL-94 testing.The molding compound has a good application prospect in the field of power device packaging.