活性稀释剂与多氟聚芳醚低介电油墨综合性能关系研究

Relationship between comprehensive properties of low dielectric ink containing multi-fluorinated poly(aryl ether)and active diluents

随着微电子领域和微电子加工技术的快速发展,通过喷墨打印技术制造微电子器件已经成为当前热门的增材制造方向。本文以扭曲非共平面的杂萘联苯和六氟异丙基为结构基元,通过亲核取代反应制备了可紫外光固化的乙烯基封端的聚芳醚预聚物,加以不同种类的双丙烯酸酯类活性稀释剂和自由基类快速光引发剂共同构建新型3D打印低介电油墨体系。结果表明:油墨体系固化前的黏度均低于300mPa·s,可加工性能良好;经UV和热固化后,红外测试表明其固化程度可达87%以上,固化基本完全;体积收缩率最低仅为2.4%,具有优异的尺寸稳定性;材料的玻璃化转变温度最高可达210℃,热分解温度最高达370℃,具备在150℃下长期使用的潜力;在10GHz测试频率下材料介电常数可达2.61,介质损耗因数仅为0.014,具有优异的介电性能。本研究制备的油墨体系可适用大曲率共形电路增材制造工艺,在微电子领域具有良好的应用前景。

With the rapid development in the field of microelectronics and microelectronics processing technology,manufacturing microelectronic devices using inkjet printing technology has become a popular direction in additive manufacturing.In this paper,an UV-curable vinyl-terminated polyarylether prepolymer was prepared by nucleophilic substitution reaction with twisted non-coplanar phthalazinone and hexafluoroisopropyl as structural units.A new low dielectric ink system for 3D printing was constructed by using diacrylate reactive diluents and free radical fast initiators into the prepolymer.The results show that the viscosity of the ink system before curing is lower than 300 mPa·s,indicating good processability.After UV and thermal curing,the infrared testing shows that the curing degree can reach over 87%,and the curing is basically complete.The minimum volume shrinkage is only 2.4%,which indicate the ink has excellent dimensional stability.The glass transition temperature of the material can reach up to 210℃,and the thermal decomposition temperature can reach up to 370℃,which indicate the ink has the potential of long-term use at 150℃.At 10 GHz,the dielectric constant of the material can reach 2.61,and the dielectric loss factor is only 0.014,which indicate the ink has excellent dielectric properties.The ink system prepared in this study is applicable to the additive manufacturing process of large curvature conformal circuit and has good application prospect in the field of microelectronics.