基于光导开关的光电集成一体化装配技术研究

随着微电子技术的发展,光导开关是一种新型的快速电子器件,在高功率脉冲、超快光电控制等领域有广泛的应用。作为一种复杂的光电混合器件,在高电压高功率应用场景下,需要同时满足微波输出、光学对位、耐高压等要求。在一体化装配过程中,碳化硅光导开关存在碳化硅晶片易碎、输入激光易损耗等问题,因此,该文从光波导装配设计、一体化装配设计和一体化装焊仿真3个方面进行研究,通过柔性装配实现耐高压光导开关封装。

With the development of microelectronic technology,photoconductive semiconductor switches is a new type of fast electronic device,which is widely used in high power pulse,ultra-fast photoelectric control and other fields.As a complex optoelectronic hybrid device,it needs to meet the requirements of microwave output,optical alignment and high voltage resistance in high-voltage and high-power applications.In the process of integrated assembly,there are some problems in silicon carbide photoconductive semiconductor switches,such as fragile silicon carbide wafer and easy loss of input laser.In this paper,the packaging of high voltage photoconductive switch is realized by flexible assembly from three aspects:optical waveguide assembly design,integrated assembly design and integrated assembly and welding simulation.