基于能量最小化的CCGA焊点形态仿真研究

Simulation Study on CCGA Solder Joint Morphology Based on Energy Minimization

为了确定某陶瓷柱栅阵列(CCGA)器件实现高焊接可靠性时的工艺参数组合范围,并研究焊点形态随不同参数变化的规律,以钎料润湿角、钎料体积以及焊柱偏移量作为关键变量因素,利用基于能量最小化原理的Surface Evolver软件,计算了不同因素水平组合下的实际焊点形态,并对参数化建模过程进行了详细介绍。通过对比形态结果与焊点可接收标准,寻找能够产生合格焊点的参量范围,为实际焊点微连接生产工艺提供合理的工艺指导。

In order to determine the range of process parameter combinations for a ceramic column grid array(CCGA)device to achieve high soldering reliability,and study the variation of solder joint morphology with different parameters,the wetting angle of brazing filler metal,the volume of brazing filler metal and the offset of soldering column are taken as the key variables,Surface Evolver software based on the principle of energy minimization is used to calculate the actual morphology of solder joints under different combination of factors,and the parametric modeling process is introduced in detail.By comparing the morphology result with the acceptable standards of the solder joints,the range of parameters that can generate the qualified solder joints is found,and the reasonable process guidance for the actual production process of the solder joint micro-connections is provided.