低熔点合金相变热沉设计与散热性能研究

Design of Low Melting Point Alloy Phase Change Heat Sink and Study on Its Heat Dissipation Performance

为了解决电子设备在无风无液环境下短时动态大功率工作时的散热问题,提出了一种带导热翅片结构的低熔点合金相变热沉,同时建立了考虑合金液固相变时体积收缩影响的热仿真模型,并对低熔点合金相变热沉的散热性能进行了仿真和试验研究。结果表明,低熔点合金相变热沉的散热性能明显优于烷烃类相变热沉。在相同工况下,低熔点合金相变热沉相较于相同体积或质量的烷烃类相变热沉,发热片的最高温度分别降低了71.9℃和32.7℃。另外,发热功率、安装姿态等因素对该类相变热沉的散热性能也有较大影响,与正放时相比,反放和立放时发热片的最高温度分别升高了15℃和12.9℃。

To address the heat dissipation challenges of electronic devices in its short-term dynamic high-power operation without wind and coolant,this study proposes a low melting point alloy phase change heat sink with thermalfin structure.A thermal simulation model considering the volume shrinkage during liquid-solid phase transition of the alloy is developed.The heat dissipation performance of the heat sink is studied by simulation and experiment.Results show that the heat dissipation performance of low melting point alloy phase change heat sink is significantly better than that of alkane phase change heat sink.Under the same operation conditions,the maximum temperature of heating element of alloy heat sink is reduced by 71.9℃ and 32.7℃ compared to that of alkane heat sink respectively,when they have the same volume or the same mass.In addition,factors such as heating power and installation pose also have significant impact on the heat dissipation performance of the alloy heat sink.Compared to forward installation,reverse or vertical installation leads to an increase in maximum temperature of heating element by 15℃ and 12.9℃ respectively.