LED封装用环氧树脂AB胶的进展

Progress of epoxy resin AB adhesive for LED encapsulation

本文介绍了国内LED封装用环氧树脂AB胶的发展历程,从最初的液体双酚A环氧树脂的应用,到脂环族环氧树脂以及最近有机硅杂化脂环族环氧树脂的应用。重点分享了直插式LED以及数码管封装用环氧树脂胶、SMD RGB封装用环氧树脂AB胶以及Mini LED封装用环氧树脂AB胶(如复合胺固化的环氧树脂AB胶、哑光显示屏封装用环氧树脂AB胶、热阳离子固化的环氧树脂AB胶以及酸酐固化有机硅杂化脂环族环氧树脂AB胶等)的配方、性能和国内外研究进展,并对未来新型环氧树脂的开发要求和发展趋势进行了展望。

In this paper,the development process of epoxy resin AB adhesive for LED encapsulation in China,from the initial application of liquid bisphenol A epoxy resin to cycloaliphatic epoxy resin,and recently the application of silicone hybrid cycloaliphatic epoxy resin was introduced.The formulation,performance,and research progress of epoxy resin adhesive for direct-insertion LED and digital tube encapsulation,epoxy resin AB adhesive for SMD RGB encapsulation,and epoxy resin AB adhesive for Mini LED encapsulation(such as compound amine cured epoxy resin AB adhesive,epoxy resin AB adhesive for matte display screen encapsulation,heat cation-cured epoxy resin AB adhesive,and anhydride-cured silicone hybrid cycloaliphatic epoxy resin AB adhesive,etc.) both domestically and internationally were shared in details.The development requirements and trends of future new epoxy resins were also discussed.