电子元器件粘接用单组分环氧胶的制备与性能研究

Preparation and properties of single component epoxy adhesive for electronic component bonding

针对电子元器件粘接用途,制备了单组分中低温固化环氧胶粘剂。主要研究了不同类型环氧树脂、填料以及固化促进剂对其拉伸剪切强度、拉伸强度、断裂伸长率和固化性能的影响。研究结果表明:以双酚F型环氧树脂为基础聚合物制备的单组分环氧胶粘剂,相对于双酚A型及聚氨酯改性型环氧树脂,显示出更优的粘接强度及较低的硬度;搭配碳酸钙使用时,拉伸剪切强度较硅微粉、高岭土明显提升,且断裂伸长率达到约55%,具有一定的弹性;采用相同量的促进剂,固化促进速率依次为改性脲促进剂>改性胺促进剂>咪唑促进剂;开发的单组分环氧胶粘剂产品在常温下可正常存放3周,使用方便,兼具良好的固化效率,力学性能优异,可应用于电子元器件的结构粘接。

The single component medium & low-temperature curing epoxy adhesive was prepared for electronic component bonding.The effects of different types of epoxy resins,fillers,and curing accelerators on their tensile shear strength,tensile strength,elongation at break,and curing properties were mainly studied.The research results showed that the single component epoxy adhesive prepared based on bisphenol F-type epoxy resin exhibited better bonding strength and lower hardness compared to bisphenol A-type and polyurethane modified epoxy resin.When used in combination with calcium carbonate,the tensile shear strength was significantly improved compared to silicon micro powder and kaolin,and the elongation at break reached about 55%,indicating a certain degree of elasticity.Using the same amount of accelerator,the curing promotion rate was in the order of modified urea accelerator > modified amine accelerator > imidazole accelerator.The developed single component epoxy adhesive product could be stored normally for 3 weeks at room temperature,was easy to use,had good curing efficiency and excellent mechanical properties,which could be applied to the structural bonding of electronic components.