光固化陶瓷坯体的增材制造与性能研究

Study on Additive Manufacturing and Properties of Photocurable Ceramic Body

为满足光固化增材制造陶瓷浆料的使用需求,对陶瓷粉体形貌进行了观察,考察了分散剂类型、固含量对陶瓷浆料表观黏度的影响,并对优化后的陶瓷浆料进行光固化成型。结果表明,陶瓷粉体分散较为均匀,粒径主要分布在200~500 nm,D50约为0.32μm。KOS110作为分散剂可以有效降低陶瓷浆料的表观黏度;在剪切速率为50s-1时,随着分散剂添加量从1%增加至8%,陶瓷浆料的表观黏度先减小后增加,在分散剂添加量为2%时取得最小值。在相同剪切速率下,陶瓷浆料的固含量体积分数越大,其表观黏度越大,适宜的陶瓷浆料的固含量应该在52%及以下。当扫描速度为1~10 m/s时,陶瓷浆料的固化深度都高于设计厚度(25μm),满足陶瓷浆料增材制造要求。

In order to meet the usage requirements of photo curing additive manufacturing of ceramic slurry,the morphology of ceramic powder was observed,and the effects of dispersant type and solid content on the apparent viscosity of ceramic slurry were investigated.The optimized ceramic slurry was then photo cured.The results showed that the ceramic powder was evenly dispersed,with a particle size mainly distributed between 200~500 nm and a D50 of approximately 0.32μm.KOS110 as a dispersant can effectively reduce the apparent viscosity of ceramic slurries;At a shear rate of 50 s-1,as the amount of dispersant added increased from 1%to 8%,the apparent viscosity of the ceramic slurry first decreased and then increased.The minimum apparent viscosity of the ceramic slurry was obtained when the amount of dispersant added was 2%.At the same shear rate,the larger the volume fraction of solid content,the higher the apparent viscosity of ceramic slurry.The appropriate solid content of ceramic slurry should be 52%or less.When the scanning speed was between 1 m/s and 10 m/s,the curing depth of the ceramic slurry was higher than the design thickness(25μm),meeting the requirements for additive manufacturing of ceramic slurry.