HEDP镀铜与氰化镀铜工艺性能对比研究

Comparative Study on the Performance of HEDP Copper Plating and Cyanide Copper Plating Processes

为了探究羟基亚乙基二膦酸(HEDP)镀铜工艺的工程化应用的可行性,分别采用HEDP镀铜与氰化(CN)镀铜方法在A3钢表面制备铜镀层,对比2种工艺制备铜镀层的宏微观形貌、沉积速率、分散能力及深镀能力,同时对HEDP铜镀层的结合力及氢脆性能进行表征。结果表明:HEDP铜镀层结晶细致、晶粒呈紧密的沟壑起伏分布;氰化铜镀层呈大小不一的颗粒状结构。当电流密度为1.0 A/dm^(2)时,HEDP铜镀层的沉积速率达到0.19μm/min,较CN镀铜工艺0.14μm/min的沉积速率提高了35.7%。HEDP镀铜与CN镀铜工艺的分散能力、深镀能力相当。HEDP铜镀层在钢铁基体表面的结合力良好,氢脆性能合格。

In order to assess the potential for implementing the 1-hydroxyethylidene-1,1-diphosphonic acid(HEDP)copper plating process in engineering applications,copper coatings were prepared on the surfaces of A3 steel substrates using HEDP plating method and cyanide plating method.The macroscopic and microscopic morphologies,deposition rates,dispersion abilities,and deep plating capabilities of the copper coat-ings produced by the two processes were compared.Additionally,the coating adhesion and hydrogen embrittlement performance of the HEDP copper plating layer were characterized.Results showed that the HEDP copper plating layer exhibited fine crystallization with a dense distribu-tion of grain grooves and undulations.The cyanide copper plating layer,on the other hand,displayed a granular structure with grains of varying sizes.At a current density of 1.0 A/dm^(2),the deposition rate of the HEDP copper coating reached 0.19μm/min,which was 35.7%higher than the 0.14μm/min deposition rate observed in the cyanide copper plating process.The dispersion and deep plating capabilities of both the HEDP and cyanide copper plating processes were found to be comparable.Additionally,the HEDP copper plating layer demonstrated good adhesion to the steel substrate and qualified hydrogen embrittlement performance.