飞行器智能蒙皮异质多层电路制造技术进展

Advances in Manufacturing Technologies for Heterogeneous Multilayer Circuit of Aircraft Smart Skin

智能蒙皮在飞行器承载结构蒙皮表面集成异质多功能电路系统,是实现未来变体飞行器“Fly-by-Feel”的使能技术。飞行器智能蒙皮涉及多功能分布式传感系统、共形天线、频率选择表面、防/除冰等功能模块,这提升了飞行器态势感知能力并促进其结构向轻量化发展,其技术关键在于复杂3D结构表面异质多层电路的成型制造。针对智能蒙皮多功能电路制造难题,本文对不同种类曲面功能单元制造中的难点进行详细分析,并对比阐述适用于不同类型结构的制造技术,包括共形打印、通孔互联、曲面贴装、薄膜制备等。最后总结和展望了智能蒙皮异质多层电路制造技术面临的挑战和潜在解决方案,为下一代飞行器智能蒙皮制造技术的突破提供有益的参考。

Smart skin seamlessly integrates a heterogeneous multifunctional circuit system on the surface of the load-bearing structure of an aircraft,serving as an enabling technology for achieving the“Fly-by-Feel”capability in future variant aircraft.The smart skin of the aircraft involves various functional modules,including multifunctional distributed sensing systems,conformal antennas,frequency-selective surfaces,and anti/de-icing.This integration enhances the aircraft’s situational awareness and promotes the development of lightweight structures,and the technical key is the fabrication of heterogeneous multilayer circuits on the intricate 3D surfaces.In addressing the manufacturing challenges associated with the multifunctional circuits of smart skin,this paper provides a detailed analysis of the difficulties encountered in the manufacturing of different types of curved functional units.Additionally,it compares and elucidates manufacturing technologies applicable to diverse structural types,encompassing conformal printing,via-hole interconnection,curved surface attach,and thin-film fabrication.Finally,the paper summarizes and forecasts the challenges and potential solutions confronting the manufacturing technology for heterogeneous multilayer circuits in smart skin,offering valuable insights for the breakthrough of next-generation aircraft smart skin manufacturing processes.