计及IGBT模块键合线与芯片焊料层老化的热网络法结温计算

Junction Temperature Calculation by Thermal Network Method Considering IGBT Module Bonding Wire and Chip Solder Layer Aging

文中提出一种计及IGBT模块键合线与芯片焊料层老化的热网络法结温计算,基于Simulink对短时间尺度下损耗与结温的相互依赖关系进行更新,并分别通过双脉冲测试及有限元仿真修正长时间尺度下键合线与芯片焊料层老化对IGBT结温计算的影响,在此基础上,根据芯片焊料层不同老化状态下键合线的应力特征,实现两种老化模式的相互关联,较为准确地计算IGBT结温。最终利用试验平台与传统结温计算方法进行对比验证了所提结温计算方法的准确性。该结温计算方法有助于在实际运行工况及IGBT模块老化状态下精确计算结温。

This paper proposes a thermal network method for junction temperature calculation that takes the aging of IGBT module bonding wires and chip solder layers into account.The interdependence between loss and junction temperature in short time scales is updated based on Simulink,the two-pulse test and finite Meta-simulation corrects the influence of bonding wire and chip solder layer aging on IGBT junction temperature calculation under long-term scale.Correlation,more accurate calculation of IGBT junction temperature.Finally,the accuracy of the proposed junction temperature calculation method is verified by comparing the experimental platform with the traditional junction temperature calculation method.The junction temperature calculation method is helpful to accurately calculate the junction temperature under the actual operating conditions and the aging state of the IGBT module.