实心焊丝化学镀铜工艺改进及质量控制

Improvement and quality control of chemical copper plating process for solid welding wireImprovement and quality control of chemical copper plating process for solid welding wire

焊丝表面镀铜传统工艺中存在不容易获得均一、稳定的镀铜层质量以及镀铜液补正困难两个缺点。通过镀铜液增加硫酸亚铁抑制铜的快速生成以获得良好的镀铜附着性;增加了一个由硫酸铜和硫酸组成的补充液副槽,实现了对镀铜液的加水补正。镀铜工艺中,质量控制重点是对镀铜液各组分含量的管控,给出了镀铜液各组分浓度管理图表。

In traditional process of copper plating on welding wire surface,there are two shortcomings:it is not easy to obtain uniform and stable copper plating layer quality,and it is dfficult to correct copper plating solution.By increasing ferrous sulfate in copper plating solution,the rapid formation of copper is inhibited to obtain good copper plating adhesion.A supplementary liquid sub-tank composed of copper sulfate and sulfuric acid was added to realize water addition and correction of copper plating solution.In copper plating process,quality control focus is control of each component content of copper plating solution,management chart of each component concentration of copper plating solution is given.