后摩尔时代激光技术在集成电路制造中的应用

Application of Laser Technology in Integrated Circuit Manufacturing in the Post-Moore Era

随着摩尔定律逼近物理极限,集成电路制造领域正寻求突破传统技术的创新方法,先进制程和先进封装是未来集成电路制造的两大重点发展方向。激光技术作为一种无机械接触的高精度加工手段,其微尺度精准物理调控能力具有突出优势。重点讨论激光技术在集成电路制造中的多样化应用,如极紫外线光刻机(extreme ultraviolet,EUV)在先进制程中的应用,激光技术在硅通孔(through silicon via,TSV)、键合/解键合、激光划片、隐切和激光退火等先进封装技术中的关键作用。这些技术不仅提升了集成电路的性能和能效比,还为实现更低成本、更小尺寸的集成电路提供了可能。本文总结了激光技术在集成电路制造中的发展前景和面临的挑战,指出了技术创新和工艺改进的必要性,并展望了激光技术将如何助力集成电路产业实现新的突破和发展。

As Moore′s Law nears its physical constraints,the pursuit of innovative techniques in integrated circuit(IC)fabrication intensifies,focusing on advanced processes and packaging methodologies.As a high-precision processing method without mechanical contact,laser technology has outstanding advantages in its micro-scale precise physical control capabilities.This paper delves into the diverse applications of laser technology within IC fabrication,including its pivotal role in EUV(extreme ultraviolet)lithography for advanced processes and its utilization in TSV(through dilicon vias),bonding/debonding,laser scribing,hidden cutting,and laser annealing—all of which are essential in advanced packaging technologies.This article summarizes the development prospects and challenges faced by laser technology in IC fabrication,points out the necessity of technological innovation and process improvement,and looks forward to how laser technology will help the IC industry achieve new breakthroughs and development.