摘要
系统级封装SiP(System in a Package)已成为后摩尔时代延续摩尔定律的主要技术路线,电子装备小型化和多功能化的推动,使其在领域具有广阔前景。描述了一种基于SiP技术小型化多核信号处理的实现方案,详细讲述了芯片级设计及封装的具体方法和思路,提出了一种基于SiP技术的多核处理器微系统设计及实现。
System-in-package(SiP)has become the main technical route to continue Moore's law in the post-Moore era.Driven by the miniaturization and multi-functionality of electronic equipment,it has broad prospects in the field.This paper describes an implementation scheme for miniaturized multicore signal processing based on SiP technology.The specific methods and ideas of chip-level design and packaging are described in detail.The design and implementation of a multi-core processor microsystem based on SiP technology is proposed.
作者
梁涛涛
李岩
刘振华
Liang Taotao;Li Yan;Liu Zhenhua(No.58 Research Institute of China Electronics Technology Group Corporation,Wuxi 214072,China)
出处
《电子技术应用》
2024年第9期83-88,共6页
Application of Electronic Technique
