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Laser-based defect characterization and removal process for manufacturing fused silica optic with high ultraviolet laser damage threshold

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摘要 Residual processing defects during the contact processing processes greatly reduce the anti-ultraviolet(UV)laser damage performance of fused silica optics,which significantly limited development of high-energy laser systems.In this study,we demonstrate the manufacturing of fused silica optics with a high damage threshold using a CO_(2)laser process chain.Based on theoretical and experimental studies,the proposed uniform layer-by-layer laser ablation technique can be used to characterize the subsurface mechanical damage in three-dimensional full aperture.Longitudinal ablation resolutions ranging from nanometers to micrometers can be realized;the minimum longitudinal resolution is<5 nm.This technique can also be used as a crack-free grinding tool to completely remove subsurface mechanical damage,and as a cleaning tool to effectively clean surface/subsurface contamination.Through effective control of defects in the entire chain,the laser-induced damage thresholds of samples fabricated by the CO_(2)laser process chain were 41%(0%probability)and 65.7%(100%probability)higher than those of samples fabricated using the conventional process chain.This laser-based defect characterization and removal process provides a new tool to guide optimization of the conventional finishing process and represents a new direction for fabrication of highly damage-resistant fused silica optics for high-energy laser applications.
出处 《Light(Advanced Manufacturing)》 2023年第3期181-194,共14页 光(先进制造)(英文)
基金 supported by the National Key Research and Development Project(2022YFB3403400) Shanghai Sailing Program(20YF1454800) National Natural Science Youth Foundation of China(62205352) Natural Science Foundation of Shanghai(21ZR1472000) Key Projects of the Joint Fund for Astronomy of the National Natural Science Funding of China(U1831211),and the Youth Innovation Promotion Association of the Chinese Academy of Sciences.
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