摘要
裂纹是电子元器件封装失效的一个重要指标。基于贴片式网络变压器在再流焊组装过程中出现开裂质量缺陷问题,从灌封材料固化后内部缺陷和内应力,以及材料的热膨胀系数、吸潮特性等方面对开裂形成机理展开分析。对变压器生产方和用户方提出了预防开裂的方法,针对用户方,通过试验验证,得出在装配前进行烘烤可有效防止网络变压器高温开裂。
Crack is an important index of package failure of electronic components.Based on the crack quality defects in the process of reflow soldering of the network transformer,the cracking formation mechanism is analyzed from the aspects of internal defect and internal stress after curing of the potting material,thermal expansion coefficient of the material and moisture absorption characteristics.The method of preventing cracking is put forward for the transformer manufacturer and user.Through the experimental verification,it is concluded that high temperature cracking of network transformer can be effectively prevented by baking before assembly.
作者
毛久兵
李胜红
陈锐
郭元兴
杨唐绍
秦宗良
高燕青
邴继兵
黎全英
杨伟
MAO Jiubing;LI Shenghong;CHEN Rui;GUO Yuanxing;YANG Tangshao;QIN Zongliang;GAO Yanqing;BING Jibing;LI Quanying;YANG Wei(The 30th Research Institute of CETC,Chengdu 610041,China;The First Military Representative Offi ce of the Military Representative Bureau of the Equipment Development of the Central Military Commission in Chengdu,Chengdu 610041,China)
出处
《电子工艺技术》
2024年第5期17-20,共4页
Electronics Process Technology
关键词
网络变压器
再流焊
开裂
灌封工艺
network transformer
reflow soldering
cracking
potting process