基于国产胶的底部填充工艺优化及可靠性验证

Optimization and Reliability Verification of Underfilling Process Based on Domestic Adhesive

研究了基于硅通孔(TSV)转接板的倒装芯片叠层组装用的国产底部填充胶,验证了底部填充胶的流动性及可操作性。通过理论计算和仿真分析,结合样品可靠性考核,明确U21308是一种适合硅通孔转接板倒装焊芯片叠层组装的底部填充胶。分析底部填充过程气泡问题,对底部填充工艺进行了优化,增加了填充前烘烤、等离子清洗、填充胶排泡等工艺控制措施,形成了一套完整的工艺流程,确保底部填充空洞率≤5%。

The domestic underfilling adhesive used for flip chip stack assembly based on silicon through hole (TSV) adapter plates is investigated,the flowability and operability of the underfilling adhesive are verified.Through theoretical calculation and simulation analysis,combined with sample reliability assessment,It is clear that U21308 is a underfilling adhesive suitable for flip chip stack assembly of silicon through hole adapter plates.By analyzing the bubbles problem in the underfilling process,the underfilling process is optimized,and the process control measures such as baking before filling,plasma cleaning,and foam removal of the filling adhesive are added to form a complete process flow to ensure that the underfilling void rate is less than 5%.