加压装置在晶圆键合系统中的应用

Application of Pressurization Device in Wafer Bonding System

加压系统作为高精度晶圆键合设备的核心组件,其性能和稳定性直接影响晶圆键合质量和成品率。探讨了加压系统对晶圆键合工艺的影响,对比分析了气缸、液压缸、电缸和气液混合缸等加压装置在晶圆键合工艺中的优缺点。认为最适合高精度晶圆键合设备的加压方案为利用气液混合缸的方式。进一步分析了气液混合缸在晶圆键合设备中的应用原理,并通过实际验证效果对其性能进行了评价。展望了气液混合缸在高精度晶圆键合设备中的应用前景,并探讨了其在未来市场的发展潜力。

As the core component of high-precision wafer bonding technology,the performance and stability of the pressurization system directly affect the bonding quality and yield.The impact of pressurization system on wafer bonding process is explored,the advantages and disadvantages of pressurization devices such as cylinders,hydraulic cylinders,electric cylinders,and gas-liquid mixing cylinders in wafer bonding processes are compared and analyzed.It is considered that the most suitable pressure scheme for high-precision wafer bonding equipment is the gas-liquid mixing cylinder.Further analysis is conducted on the application principle of gas-liquid mixing cylinder in wafer bonding equipment,and its performance is evaluated through actual verification.The application prospects of gas-liquid mixing cylinder in high-precision wafer bonding equipment is discussed,and its development potential in the future market is explored.