电镀竖向同电位铜厚差异的改善探讨

Improvement of abnormal copper thickness on electroplating vertical plate edge

垂直连续电镀(VCP)线由于其高效率、高稳定性、高精度、低成本等优点,在印制电路板(PCB)生产中已逐步取代传统龙门式电镀设备,广泛运用于全板电镀、图形电镀及微孔电镀。针对VCP的导电结构及电镀原理展开分析,通过对比实验,研究分析了造成整板电镀竖向同电位铜厚异常的原因,并通过制定相应的措施,有效解决了因飞钯导电不良导致的镀铜差异性问题。

Vertical conveyor plating(VCP)line,owing to its high efficiency,high stability,high precision,low cost and other advantages,has been widely used in whole plate plating,graphic plating and micro-porous plating in printed circuit board(PCB)production.In this paper,the conductive structure and electroplating principle of VCP are analyzed.Through comparative experiments,the causes of abnormal copper thickness on the vertical edge of the whole plate electroplating are studied and analyzed,and the differences in copper plating caused by poor electrical conductivity of flying palladium are effectively solved by developing corresponding measures.