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SiBCN陶瓷前驱体改性邻苯二甲腈树脂的制备及性能研究

Study on Preparation and Properties of Phthalonitrile Resin Modified by SiBCN Ceramic Precursor
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摘要 随着先进装备的发展速度越来越快,提升聚合物的耐温等级,对拓展其在航空航天领域的应用具有重要意义。本文通过利用SiBCN陶瓷前驱体改性4,4’-(1,3-苯氧基)邻苯二甲腈树脂(APN)制备了耐高温聚合物材料(CPN),研究了改性树脂的耐热性能及机理。该树脂具有优良的耐热性能,当SiBCN质量分数为20%时,CPN质量损失10%时的温度(T_(d)^(10))为608.07℃(N_(2)氛围)。动态力学分析(DMA)的结果表明,CPN碳纤维复合材料的玻璃化转变温度高于500℃,比APN-NH_(2)碳纤维复合材料的玻璃化温度高出约100℃;当SiBCN质量分数为40%时,CPN能够在900℃有氧环境下经过30 min处理后仍然保持完整形貌;研究发现,高温条件下CPN内部形成键能较大的Si—O和B—O键,从而显著提升其耐热性能。 With the rapid development of advanced equipements,it is of great significance to improve the heat resistance for polymer to expand its application in aerospace field.In this paper,4,4'-(1,3-phenoxy)phthalonitrile resin(APN)was modified with SiBCN ceramic precursor to produce high heat resistant material(CPN)and the heat resistance property and mechanism of the modified resin were studied.The results show that when SiBCN mass fraction is 20%,the T_(d)^(10) of the CPN is 608.07℃(N_(2)).According to the dynamic mechanical analysis(DMA)results,the glass transition temperature of CPN carbon fiber composites is higher than 500℃,which is 100℃higher than that of APN-NH_(2)carbon fiber composites.When SiBCN mass fraction is 40%,the CPN can maintain the integrity of appearance morphology after 30 min treatment at 900℃under aerobic environment.The ceramic precursors can form Si-O and B-O bonds in the modified resin under high temperature conditions,which significantly improves the heat resistance.
作者 熊靖芸 王子龙 刘文彬 周恒 赵彤 XIONG Jingyun;WANG Zilong;LIU Wenbin;ZHOU Heng;ZHAO Tong(State Key Laboratory of Advanced Forming Technology and Equipment,China Academy of Machinery Science and Technology Group Co.,Ltd.,Beijing 100083;College of Materials Science and Chemical Engineering,Harbin Engineering University,Harbin 150001;Institute of Chemistry,Chinese Academy of Sciences,Beijing 100190)
出处 《宇航材料工艺》 CAS CSCD 北大核心 2024年第4期43-50,共8页 Aerospace Materials & Technology
关键词 邻苯二甲腈树脂 陶瓷前驱体 耐热性能 固化 热氧稳定性 Phthalonitrile resin Ceramic precursor Heat-resistance Curing Thermal oxygen stability
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