特种器件低成本替代可行性研究

Feasibility Study on Low-Cost Substitution of Special Devices

随着特种器件国产化覆盖率的不断提高,目前面临的一大难题是元器件成本居高不下。为了解决这一问题,民用领域主流的商业级、工业级、车规级器件成为了低成本替代的关注对象。本文结合研究特种级器件与商业级、工业级、车规级芯片质量管控体系及可靠性测试覆盖率的差异,探究民用塑封作为特种替代的可行性。

With the continuous improvement of the localization coverage of special devices,a major problem facing is the high cost of devices.In order to solve this problem,the mainstream commercialgrade,industrial-grade,and vehicle-grade chips in the civilian field have become the focus of lowcost alternatives.This article combines the research on the differences in quality control systems and reliability testing coverage between special grade chips and commercial,industrial,and automotive grade chips,and explores the feasibility of using civilian plastic packaging as a special substitute.