基于骨架结构设计的高性能W10Cu材料制备及表征

Preparation and characterization of high performance W10Cu materials based on skeleton structure design

用商用不规则W粉和球形W粉压制W骨架坯,经1800~2000℃真空烧结制备W骨架,在H_(2)气氛1350℃下熔渗Cu获得高致密W10Cu复合材料。结果表明:等离子球化W粉团聚消失,流动性更好,松装密度提升82%,相同压力下压坯密度提升15%。用球形W粉制备的W骨架可保持低的W-W连接度及良好的通孔率,为熔渗提供高品质骨架材料。W骨架经熔渗4h后获得W10Cu块体材料,其室温拉伸强度为680MPa,电导率为1.856S/m,比商用W10Cu的拉伸强度、电导率分别提升了41%、28%,可归因于低W-W连接度、Cu相良好的网状结构、Cu对W颗粒的包覆协同作用结果。本研究中新型低W-W连接度骨架结构设计可为高比重W、高通孔率W-Cu材料设计与开发提供思路。

The W skeleton was pressed by commercial irregular W powder and spherical W powder,and the W skeleton was prepared by vacuum sintering at 1800-2000℃,and the highly dense W10Cu composite was obtained by melting Cu in H_(2) atmosphere at 1350℃.The results show that the plasma spheroidized W powder agglomeration disappears,the fluidity is better,the loose packing density increases by 82%,and the compact density increases by 15%under the same pressure.The W skeleton prepared with spherical W powder can maintain low W-W connection and good through-hole ratio,and provide high quality skeleton material for infiltration.W10Cu block material was obtained after 4 h fusion of W matrix.The tensile strength at room temperature is 680 MPa and the conductivity is 1.856 S/m,which is 41%and 28%higher than that of commercial W10Cu,respectively,which can be attributed to the synergistic effect of low W-W connectivity,good network structure of Cu phase and coating structure of Cu on W particles.The design of new low W-W connection skeleton structure in this study can provide ideas for the design and development of high gravity W and high porosity W-Cu materials.