高导热聚合物/石墨烯热界面材料研究进展

Research progress of polymer/graphene thermal interface materials with high thermal conductivity

电子设备和器件的过热问题已严重影响其稳定性、可靠性和使用寿命,热界面材料对于降低电子设备和器件的工作温度至关重要.聚合物与石墨烯复合制备的高导热性能热界面材料广泛应用于消费电子产品、信息技术、医疗设备等方面.在阐述聚合物热界面材料导热机理的基础上,总结了石墨烯的本征特性对聚合物/石墨烯热界面材料导热性能的影响,重点介绍了提高聚合物/石墨烯热界面材料导热性能的方法,最后展望了该材料的发展方向.

The overheating problem of electronic devices has seriously affected their stability,reliability,and service life.Thermal interface materials(TIM)are crucial for reducing the operation temperature of electronic devices.The high thermal conductivity TIM prepared by combining polymers with graphene is widely used in consumer electronics,information technology,medical equipment and other fields.In this paper,the thermal conductivity mechanism of polymer TIM was expounded,the influence of the intrinsic characteristics of graphene on the thermal conductivity of composites was summarized,and the methods to improve the thermal conductivity of polymer/graphene TIM were emphatically introduced.Finally,the development directions of TIM were prospected.