树脂基和陶瓷基复合材料拉伸变形和微观损伤机理对比研究

Comparative Study on Tensile Deformation and Micro Damage Mechanisms of Resin Based and Ceramic Based Composite Materials

通过SEM对两种复材进行了微观形貌表征,对比分析两种复合材料微观结构的异同;结合拉伸试验应力-应变曲线与失效试样的断口形貌,分析了CFRP复合材料及2DC/SiC复合材料拉伸过程中的损伤行为和断裂机制。研究表明:2DC/SiC材料具有PyC界面层,内部存在三种尺度的缺陷且随机分布。而树脂基复合材料没有明确边界,材料内部纤维排列紧密,无明显缺陷。两种材料拉伸变形过程分为三个损伤阶段,2DC/SiC材料损伤模式有三类,即基体开裂、界面脱粘、纤维断裂;树脂基复合材料损伤模式分为五种,即基体开裂、纤维基体界面脱粘、分层、纤维束抽拔、纤维断裂。

The microstructure of two composite materials was characterized by SEM,and the similarities and differences in the microstructure of the two composite materials were compared and analyzed.By combining the stress-strain curve of the tensile test with the fracture morphology of the failed specimen,the damage behavior and fracture mechanism during the tensile process of CFRP composite materials and 2D C/SiC composite materials were analyzed.The research has shown that 2D C/SiC materials have a PyC interface layer,and there are three types of defects with random distribution inside.However,resin based composite materials do not have clear boundaries,and the internal fibers of the material are tightly arranged without obvious defects.The tensile deformation process of two materials involves three damage stages.There are three types of damage modes in 2D C/SiC materials,include matrix cracking,interface debonding,and fiber fracture.The damage modes of resin based composite materials are divided into five types,include matrix cracking,fiber matrix interface debonding,delamination,fiber bundle pulling,and fiber fracture.