摘要
使用丝网印刷工艺生产厚膜印刷陶瓷基板时,经常会出现版内不同区域印刷电阻不一致的问题。通过对丝网印刷过程中的网版张力、回弹力以及刮刀下压力的综合分析,得出印刷在承印物上的浆料量与网版张力、回弹力及下压力的合力成正相关的关系,进而分析得到刮刀印刷方向对于线型电阻的印刷有较大影响。经实验验证,相较于传统的刮刀平行于线型电阻长度方向印刷,当刮刀垂直于线型电阻长度方向进行印刷时,版内电阻漂移率从11.24%缩窄至4.46%,产品印刷电阻一致性得到较大程度的改善,可满足产品公差上下限要求,避免了昂贵的激光修阻工艺,节约了成本。通过实验证明对于复杂图形,线条取向与刮刀印刷方向的相互关系对浆料分布的均匀性有明显影响,复杂图形也验证了该结论的普适性。
When using the screen printing technology to produce thick film printed ceramic substrates,the printing resistance of different areas on the substrate is usually different.Through the comprehensive analysis of the screen tension,resilience and the downward pressure of the scraper during the screen printing process,it is concluded that the amount of slurry printed on the substrate is positively correlated with the resultant force of the screen tension,resilience and downward pressure,and then it is concluded that the printing direction of the scraper has a great influence on the printing of linear resistance.Experiments show that compared with the traditional scraper printing parallel to the length direction of the linear resistance,when the scraper printing perpendicular to the length direction of the linear resistance,the intra plate resistance drift rate is narrowed from 11.24%to 4.46%,and the printing resistance consistency of the product is greatly improved,which can meet the requirements of the upper and lower limits of product tolerance,avoid the expensive laser resistance repair process,and save the cost.Experiments show that for complex graphics,the relationship between the line orientation and the scraper printing direction does have a significant impact on the uniformity of slurry distribution,and the universality of this conclusion has been validated through complex graphics.
作者
焦峰
邹欣
陈明祥
JIAO Feng;ZOU Xin;CHEN Mingxiang(Wuhan LEDstar Technology Co.,Ltd.,Wuhan 430206,China;School of Mechanical Science&Engineering,Huazhong University of Science and Technology,Wuhan 430074,China)
出处
《电子与封装》
2024年第9期89-95,共7页
Electronics & Packaging
关键词
丝网印刷
阻值一致性
厚膜印刷陶瓷基板
阻值漂移率
screen printing
consistency of resistance value
thick film printed ceramic substrate
resistance drift rate