多层瓷介电容器的声学扫描检查分析

Analysis of Acoustic Scanning Inspection of Multilayer Ceramic Capacitors

阐述声学扫描检查(SAM)瓷介电容器内部缺陷的可行性,探讨多层瓷介电容器声学扫描检查研究目的及价值。介绍多层瓷介电容器内部空洞、分层及裂纹等缺陷的检测方法,并对结果进行验证。

This paper describes the feasibility of acoustic scanning inspection(SAM)for detecting internal defects in ceramic capacitors,and explores the research purpose and value of acoustic scanning inspection for multi-layer ceramic capacitors.It introduces the detection methods for defects such as voids,delamination,and cracks inside multilayer ceramic capacitors,and verifies the results.