摘要
阐述高温环境下的集成电路可靠性测试方法。通过分析不同温度条件下的电路性能变化,提出一种基于加速寿命测试的可靠性评估方法。利用该方法,可以在较短时间内模拟长期高温环境对集成电路的影响,从而有效评估其可靠性。
This paper expounds the reliability testing methods for integrated circuits in hightemperature environments.A reliability evaluation method based on accelerated life testing is proposed by analyzing the changes in circuit performance under different temperature conditions.By using this method,it is possible to simulate the impact of long-term high-temperature environments on integrated circuits in a relatively short period of time,thereby effectively evaluating their reliability.
作者
杨婷
YANG Ting(CETC 54th Research Institute,Hebei 050081,China)
出处
《电子技术(上海)》
2024年第6期316-317,共2页
Electronic Technology
关键词
集成电路
可靠性测试
高温环境
integrated circuits
reliability testing
high temperature environment