AlN基板表面状态对AlN-AMB覆铜板剥离强度影响机理的研究

The mechanism of the influence of AlN substrate surface on peeling strength of AlN-AMB substrate

为了探究AlN基板表面状态对AlN-AMB覆铜板剥离强度影响的机理,对研磨型和即烧型两类AlN基板表面的微观形貌及其制备的AlN-AMB覆铜板界面反应层、断面和断层微观显微结构进行分析。结果表明,即烧型AlN基板表面平整、致密,其制备的AlN-AMB覆铜板界面反应层平整、致密,铜与AlN基板剥离的断层位于基体内部,Cu发生明显塑性变形,剥离强度高达19.053 N/mm。而研磨型AlN基板表面存在微裂纹和碎晶粒,由其制备的AlN-AMB覆铜板界面反应层凹凸不平,且不连续,钎料渗入AlN基板亚表层的微裂纹中,易于诱发应力集中,铜与AlN基板剥离的断层位于AlN基体的亚表层,Cu塑性变形小,剥离强度只有5.789 N/mm。

In order to disclose the mechanism of the influence of AlN substrate surface condition on the peeling strength of AlN-AMB substrate,the surface microstructure of the lapping type and fired type AlN substrates and the microstructure of interface reaction layer,cross section and fault of AlN-AMB substrates prepared by them were analyzed.The results show that the surface of the fired AlN substrate is compact and flat,and the interface reaction layer of the AlN-AMB substrate prepared by the fired AlN substrate is compact and flat.The fault is located in the AlN matrix,and the plastic deformation of Cu is obvious,the peeling strength is up to 19.053 N/mm.Whereas,there are microcracks and granular grains on the surface of the lapping AlN substrate.The reaction layer of the AlN-AMB substrate prepared by the lapping AlN substrate is uneven and discontinuous,the solder penetrates into the microcracks in the subsurface of the AlN substrate,which is easy to induce stress concentration.The fault is located in the subsurface of the AlN substrate.The plastic deformation of Cu is small,and the peeling strength is as low as 5.789 N/mm.