纺丝级PA66再生切片生产工艺优化及测试分析

Production Process Optimization and Test Analysis of Spinning-Grade PA66 Regenerated Chips

研究了纺丝级聚酰胺66(PA66)再生切片的生产技术,对PA66再生切片的熔点、熔程、结晶度、热稳定性能和分子结构等性能进行了分析评价,并验证了PA66再生切片的纺丝性能。结果表明,通过优化PA66废料再利用工艺技术,减少造粒过程中的黏度降及杂质含量,制备的PA66再生切片能够满足纺丝要求,拓展了再生切片的应用领域,实现了循环利用和绿色发展。

The production technology of spinning-grade polyamide 66(PA66)regenerated chips was studied.The melting point,melting range,crystallinity,thermal stability and molecular structure of PA66 regenerat⁃ed chips were analyzed and evaluated.The spinning performance of PA66 regenerated chips was verified.The results show that by optimizing the recycling process technology of PA66 waste,the viscosity drop and impurity content in the granulation process were reduced,and the prepared PA66 regenerated chips could meet the spinning requirements,expand the application fields of regenerated chips,and realize recycling and green development.