大功率光电器件光波导键合技术研究

光导开关是一种新型半导体光电子器件,在光通讯、雷达、微波等领域广泛应用,但在高工作电压的条件下会发生表面击穿等问题,因此需要对其进行封装提高侧面的耐压性能。该文选用光波导的方式对碳化硅晶片进行封装,通过玻璃浆料烧结键合、真空热压键合和光波导胶键合3种方法对小面积的侧面异质键合进行研究。通过3种方法的工艺优化及键合质量性能测试,光波导胶键合方法对激光功率的损耗最小,实现器件耐压值提升至10 kV。

The photoconductive semiconductor switches(PCSS)is a new type of semiconductor optoelectronic device,which is widely used in optical communication,radar,microwave and other fields,but surface breakdown will occur under the condition of high working voltage,so it is necessary to package it to improve the side voltage performance.In this paper,the silicon carbide wafer is encapsulated by optical waveguide,and the small area side hetero bonding is studied by glass paste sintering bonding,vacuum hot pressing bonding and optical waveguide glue bonding.Through the process optimization and bonding quality performance test of the three methods,the optical waveguide adhesive bonding method has the lowest loss of laser power,and the voltage withstand value of the device is improved to 10 kV.