细晶80W-Cu材料制备及力学性能研究

利用雾化干燥法制粉烧结一种药型罩用细晶W-Cu的材料,并对其室温下的静态和动态力学性能进行测试,结合SEM扫描电镜观察其断口形态和组织冲击变形形貌。结果表明,W含量80%的细晶W-Cu材料密度为15.57 g/cm^(3),致密度为99.18%;细晶材料晶粒形貌规则,大小约为10μm,黏结相均匀包裹W颗粒。静态拉伸强度最大达到659 MPa,延伸率为8%。应变率在1500~5000/s范围内,细晶W-Cu冲击压缩强度最高达到1450 MPa,压缩试件的塑形变形主要体现为W颗粒压扁形变。

A fine-grained W-Cu material for Shaped Charge Liners(SCLs)was sintered using spray drying method,and its static and dynamic mechanical properties were tested at room temperature.The fracture morphology and microstructure impact deformation morphology were observed using scanning electron microscopy.The results show that the density of fine-grained W-Cu material with 80%W content is 15.57 g/cm^(3),and the density is 99.18%;The grain morphology of fine-grained materials is regular,with a size of approximately 10μm.The bonding phase uniformly wraps W particles.The maximum static tensile strength reaches 659 MPa,with an elongation of 8%.Within the strain rate range of 1500~5000/s,the maximum impact compressive strength of fine-grained W-Cu reaches 1450 MPa.The plastic deformation of the compressed specimen is mainly reflected in the flattening of W particles.