化学镀法制备银包铜粉研究进展

Research progress of Cu-Ag core-shell powder prepared byelectroless plating method

银包铜粉具有优异的导电、抗氧化、抗菌和催化活性,并且具备成本经济性,被视为银粉的理想替代品,目前已在光伏、电子、医药和催化等多个领域得到应用。化学镀法是目前制备银包铜粉的最主要方法,该方法中需要使用多种化学试剂,然而现有综述文献鲜有对该方法中常用试剂的种类及作用进行阐释。本文详细阐述了不同种类试剂在化学镀法制备银包铜粉过程中的作用及机理,分析对比了不同试剂种类、工艺路线的优缺点,并展望了银包铜粉的研究趋势与技术发展方向。

Cu-Ag core-shell powders exhibit exceptional electrical,anti-oxidative,antimicrobial,and catalytic properties,coupled with cost-effectiveness,establishing them as attractive alternatives to silver powders.Their applications span photovoltaics,electronics,pharmaceuticals,and catalysis.Electroless plating is the predominant synthesis technique,utllizing various chemical reagents.However,existing reviews inadequately elucidate the types and roles of commonly employed reagents.This review provides a detailed mechanistic explication of reagent functions in the electroless plating of Cu-Ag core-shell powders.It analyzes the advantages and limitations of diverse reagents and process routes.Additionally,this review sheds light on emerging research trends and technological development directions of Cu-Ag core-shell powders.