压延铜箔的无氰电镀镍铜黑化处理工艺

Process of cyanide-free nickel copper plating blackening for calendered copper foil

为了研究出相较于电镀纯镍黑化工艺成本更低的电镀镍铜黑化工艺,以NiSO_(4)·6H_(2)O、CuSO_(4)·5H_(2)O、H_(3)BO_(3)、(NH_(4))_(2)S_(2)O_(8)和C_(6)H_(15)NO_(3)为镀液基本成分,通过加入添加剂,使金属在铜箔表面沉积形成光陷阱结构,从而实现电镀镍铜使铜箔黑化的目的。研究了镀液成分及工艺参数对黑化箔镀层亮度的影响,对黑化箔镀层的成分进行了测试,并对黑化箔镀层结构进行了观察分析。研究结果表明:电镀镍铜的黑化箔镀层中Cu代替Ni形成镀层,黑化箔镀层成分为NiCu;通过加入添加剂可以使电镀时使用的电流密度降低,达到了降低成本的目的。

In order to develop a nickel copper plating blackening process with lower cost compared to pure nickel plating blackening process,taking NiSO_(4)·6H_(2)O,CuSO_(4)·5H_(2)O,H_(3)BO_(3),(NH4)_(2)S_(2)O_(8),and C6H15NO3 as basic components of plating solution,metal is deposited on the surface of the copper foil to form a light trap structure by using additives,thereby achieving the goal of blackening the copper foil byplating nickel copper.The effects of plating solution and process parameters on the light of the plating layer were studied.The composition of the blackened foil plating layer was tested,and the structure of the plating layer was observed and analyzed.The research result shows that Cu replaces Ni in the plating of nickel copper blackened copper foil to form a plating layer.Through XRD analysis of the composition of the plating layer,it can be determined that the composition of the plating layer is a nickel copper alloy.At the same time,the additives can reduce the current density duringplating,achieving the goal of low costs.